Program Management Engineer | HVDC

Change the world. Love your job.

The High Voltage Direct Current (HVDC) within the High Voltage Power business is seeking a technically skilled, energetic, competitive, and results-oriented leader who enjoys deploying new products and technologies to market as a Program Management Engineering.

In this role, you will lead new products from concept to release in partnership with other leaders in the organization and across TI. You will have the opportunity to learn and influence in emerging areas such as GaN new processes, package, IP and test for Datacenter ASSPs, Industrial and automotive applications. On this team, you will be a part of a professional and inclusive work environment where you are expected to challenge teammates to achieve flawless execution goals while maintaining strong working relationships.

Responsibilities include:

• Lead cross-functional teams through the complete product development lifecycle, inspiring flawless execution through effective meeting facilitation, clear communication channels, and meticulous documentation practices to ensure successful return on investment for all development initiatives
• Create and actively monitor comprehensive project plans including risk management, resource allocation, specification compliance, budget constraints, and schedule adherence.
• Inspire and lead cross-functional teams toward flawless product and project execution through effective meeting facilitation, clear communication channels, and meticulous documentation practices.
• Partner with wafer fabrication, assembly and test sites to guarantee schedule adherence, cost targets, and quality standards while coordinating with PPIT partners (ATD, SCP, Kilby Labs) to define, co-develop and release new technologies aligned with HVDC roadmap products
• Prepare and deliver weekly and monthly project status updates to stakeholders that clearly identify challenges and specific support needed to ensure successful outcomes.
• Serve as liaison between internal teams and external customers to communicate project status, coordinate key milestones, and manage deliverables, including sample distribution, custom requests, capacity planning, and quality validation processes.
• Collaborate with design and systems engineering teams to create and implement productivity enhancements for Core operations while enabling accelerated Spin deployment cycles
• Create and execute qualification plans in collaboration with Product Engineering and Quality Reliability Engineering teams
• Oversee product engineering testing to ensure integrated circuits meet specifications, reliability standards, and production readiness requirements while coordinating failure analysis investigations to determine root causes of issues and drive resolution.
• Maintain Galileo system per new product development guidelines from Assess Opportunity Phase to Release to Market and Production 
• Effectively coordinate material logistics and shipment/assembly/test prioritization, setup new products in TI system using MMRs, SAP, SCS, PCS, ATSS, SWRs, others
• Success will be measured by the ability to consistently define a plan for a highly competitive product and deliver results according to the plan.

Minimum requirements:

• Bachelors in Electrical Engineering, Mechanical Engineering or related degree program

• 5+ years of experience with project engineering/management experience on highly complex products/projects

   

Preferred qualifications:

• Proven leadership capabilities in leading multifaceted global organizations
• Successful proven track record in indirect management and influence
• Ability to manage multiple projects simultaneously, and set realistic plans based on required tasks with available resources
• Ability to effectively coordinate and lead global development teams on projects that include design, silicon fabrication, production test development, qualification and production ramp; Programs will be driven out of multiple global locations
• Ability to provide clear direction to both internal teams and external support organizations like device fabrication and assembly sites
• Knowledge of device packaging and wafer fabrication process
• Knowledge of reliability requirements and tri-temp characterization methodology using statistical analysis
• Ability to work in a team environment and understand cross-functional team dynamics along with the priorities
• Ability to work with global TI field and customers to align project schedules with customers’ key milestones
• Demonstrated strong analytical and problem-solving skills
• Strong verbal and written communication skills
• Ability to influence (without direct authority) and lead teams as well as collaborate effectively with people in diverse functions and regions of the world
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results