Flex Solution Principal Engineer - Customer Program

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General Summary:

The Flex Solution Principal Engineer serves as the technical owner and primary engineering contact for assigned OEM customer programs, working directly with OEM engineering leaders and Qualcomm’s senior technical stakeholders. The role drives customer-specific Flex Platform development and leads cross-functional teams spanning platform, ADAS software, validation, and build engineering. The role also models and assesses system performance for digital cockpit and ADAS workloads by comparing projections with real-world implementations.

The principal engineer shall enable successful, scalable adoption of Qualcomm Digital Cockpit Platform and ADAS solutions across OEM programs by orchestrating multi-party alignment, ensuring robust integration, and driving safety, performance, and time-to-market outcomes.

What you’ll do: 

• Collaborate directly with OEM engineering teams to understand vehicle E/E architectures, backend systems, functional requirements, performance targets, and real-world constraints.
• Act as a senior hands‑on technical leader, directly involved in system design decisions, integration trade‑offs, issue triage, and root‑cause analysis across Digital Cockpit and ADAS domains.
• Manage multiple OEM Flex and ADAS program solution teams, supported by technical leads reporting to this role.
• Provide senior technical leadership across Qualcomm Automotive engineering teams to shape and deliver customer-specific features.
• Define the Flex Solutions team’s technical roadmap to anticipate evolving customer needs for automotive middleware across Flex and ADAS systems.
• Perform Flex‑based Digital Cockpit system integration using QNX RTOS, AUTOSAR Classic and Adaptive stacks and Android including configuration, integration, and validation.
• Integrate ADAS software stacks (Perception and Drive Policy), analyse end‑to‑end data flows and latency, and actively profile, assess, and tune system performance to meet Flex platform characterization and workload targets.
• Lead BSP and driver bring-up on customer hardware, troubleshoot low-level boot and runtime issues, and configure Qualcomm software products on customer hardware.
• Develop deep, practical expertise in Qualcomm Digital Cockpit and ADAS platforms at the SoC, system, and software stack levels.
• Co-Work with customer/Tier 1 team for Flex solution system budgets, conduct system performance analysis against worst case customer and suggest solutions interfacing with internal technical teams

Drive Continuous integration of software components for digital cockpit/ADAS subsystems and triage regressions

Minimum Qualifications:

Key Responsibilities

• Tier 1/OEM support for integration of Flex Platform BSP and ADAS stack on the customer’s hardware

• Provide overarching technical leadership for identified the OEM, across all phases (concept, development, validation, SOP, and maintenance).
• Coordinate and synchronize Qualcomm internal engineering teams (HW, SW, systems, safety, security, tools, test) to meet customer milestones.
• Drive resolution of critical technical issues, ensuring timely escalation and clear communication to both customer and Qualcomm management.
• Support design reviews, technical workshops, joint debugging sessions, and on-site integration activities as needed.

• Act as a technical role model: hands-on, detail-oriented, and able to deep-dive into complex system issues when required.
• Guide and mentor cross-functional Qualcomm teams working on the customer, helping them prioritize and solve problems effectively.
• Contribute to the best internal practices for customer engagement and ADAS solution definition.

• Act as the chief technical counterpart to the OEM’s engineering leadership for all ADAS and related programs.
• Serve as the main technical point of contact covering SoC, platform software, algorithms, tools, and system integration topics.
• Build and maintain strong, trusted relationships with the customer’s engineering executives, architects, and program leads.

• Develop and maintain a detailed understanding of the customer’s
  • E/E and compute architecture (in-vehicle and backend/cloud)
  • ADAS/AD roadmap and feature roadmap
  • Safety, security, cybersecurity, and regulatory requirements
• Anticipate customer needs and translate them into Qualcomm platform requirements, features, and solutions.

Required Qualifications

• 18+ years of experience in senior engineering roles in the Digital Cockpit/ADAS / AD domain at an OEM, Tier-1, semiconductor, or relevant technology supplier.
• Experience working directly with major global OEMs on large-scale mixed critical Digital Cockpit/ADAS programs.
• Strong background in Tier 1 automotive systems engineering with focus on:
  • BSP Integration, Performance analysis, Key Performance Indicators (KPI) management (multi virtual machine)
  • Compute platform architecture (SoC, GPU/DSP, accelerators) – Hypervisor /Virtual Machine
  • Embedded SW stacks (OS such as QNX/Linux/Android, middleware, frameworks, toolchains, AUTOSAR (Classic/Adaptive))
  • ADAS sensor integration: Cameras/RADARs/Ultrasound Sensors
  • Vehicle Interface Processor and CAN integration
  • Good understanding of Safety and Security requirements and implementation specifics for intelligent cockpit systems.
  • Desirable: ADAS/AD functions and perception / sensor fusion / planning & control
• Demonstrated ability to lead cross-functional teams without direct authority in a complex matrix organization.
• Solid understanding of automotive safety and quality frameworks (e.g., ISO 26262, ASPICE, cybersecurity standards) and their impact on architecture and execution.
• Excellent communication and presentation skills in English capable of engaging both engineering and executive audiences.
• Strong problem-solving skills, data-driven and structured, with ability to remain calm and decisive under pressure.
• Willingness to travel regularly to customers and Qualcomm sites (domestic and international).

Preferred Qualifications

• Deep familiarity with one or more of the following domains:
  • BSP Integration, Hardware Bring-up, Performance Analysis
  • HW/SW co-design and performance optimization on SoC-based ADAS ECUs
  • System Performance Analysis
  • System level triaging of issues during integration and stabilization
• Prior experience at Qualcomm, a major semiconductor vendor, or a Tier‑1 integrating high-performance automotive SoCs.
• Bachelor’s degree in electrical engineering, Computer Engineering, Computer Science, Robotics, or related field.

Personal Attributes

• Technically curious and hands-on; able to deep dive into logs, traces, and system behavior when needed.
• Outspoken and confident, yet collaborative and respectful; able to challenge and be challenged by both customer and internal teams.
• Strong ownership mindset, acting as “CEO of the account” from a technical perspective.
• Able to balance strategic, long-term roadmap thinking with tactical, day-to-day execution.

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