Microelectronics Assembler – Hybrid Thick-Film

Description

Position Summary

The Microelectronics Assembler performs precision assembly and processing of hybrid thick-film microelectronic components in a Class 10K cleanroom environment. This position involves working with delicate, lightweight components and ceramic substrates using microscopes, precision tools, and specialized manufacturing equipment.

The ideal candidate has strong manual dexterity, excellent attention to detail, and the ability to follow detailed work instructions while maintaining high standards of workmanship and quality. Experience in microelectronics or precision manufacturing is preferred, but candidates with the appropriate skills and aptitude may be considered.

Key Responsibilities

• Perform precision assembly of hybrid thick-film microelectronic components using microscopes, tweezers, and specialized hand tools.
• Handle extremely lightweight and delicate components with care to prevent damage, contamination, or defects.
• Perform microelectronic assembly processes, including die attach, die bonding, wire bonding, soldering, and epoxy dispensing, as required.
• Print and fire ceramic substrates in support of thick-film circuit manufacturing.
• Operate specialized microelectronics equipment, including wire bonders, dispensing equipment, ovens, and inspection tools.
• Follow detailed work instructions, engineering drawings, process specifications, and manufacturing travelers.
• Inspect components and assemblies under magnification to verify workmanship and conformance to quality requirements.
• Accurately document completed operations, inspection results, and production records.
• Work with engineering and quality personnel to address manufacturing issues and maintain product quality.
• Maintain cleanroom protocols, electrostatic discharge (ESD) controls, and applicable safety requirements.
• Maintain a clean, organized work area and comply with established contamination-control procedures.
• Perform other related manufacturing duties as required.

Requirements

Qualifications

• High school diploma or equivalent required; technical training or certification in electronics or a related field is preferred.
• Previous experience in microelectronics assembly, hybrid circuit manufacturing, thick-film processing, semiconductor assembly, or another precision manufacturing environment is preferred.
• Ability to perform detailed manual assembly using a microscope and precision hand tools for extended periods.
• Excellent manual dexterity and hand-eye coordination, with the ability to handle extremely small, lightweight, and delicate components.
• Strong attention to detail and  commitment to quality workmanship.
• Ability to read and follow detailed work instructions, engineering drawings, and manufacturing documentation.
• Familiarity with ESD controls, cleanroom practices, and precision assembly techniques is preferred.
• Basic computer skills for production documentation and recordkeeping.
• Ability to work independently while contributing to a team-oriented manufacturing environment.
• Willingness to learn specialized processes and equipment.

Physical Requirements

• Ability to sit or stand for extended periods while performing microscope-assisted assembly.
• Sufficient fine motor control, hand-eye coordination, and visual acuity to perform precision assembly and inspection under magnification.
• Ability to maintain consistent, careful hand movements while working with small, delicate components.

Work Environment

• Work performed in a Class 10K cleanroom and controlled manufacturing environment.
• Required use of cleanroom garments, personal protective equipment (PPE), and ESD protection as applicable.
• Potential exposure to adhesives, solvents, processing chemicals, and heated equipment in accordance with established safety procedures.
• Adherence to cleanliness, contamination control, product handling, and manufacturing process requirements.